At what frequency does skin effect start to matter? Working it out for 1oz copper
"At high frequency, current only flows near the surface" is true, but what counts as "high frequency" depends on the conductor's thickness. For 1oz copper on a PCB that is around 4MHz; for a power winding, it starts at 100kHz.
Skin depth is inversely proportional to √f
AC current concentrates near the surface and falls off exponentially with depth. The depth at which current density drops to 1/e (37%) of the surface value is the skin depth δ. For copper (ρ = 1.72×10⁻⁸ Ω·m) it is δ ≈ 66 / √f [mm] (f in Hz).
If the conductor is thinner than δ, current uses the full cross-section and skin effect is negligible. Once thickness exceeds δ by several times, the interior goes unused, the effective cross-section shrinks, and resistance rises.
| Frequency | Skin depth δ | Compare to |
|---|---|---|
| 50Hz | 9.3mm | thickness of a power cable |
| 10kHz | 0.66mm | starts to matter for φ1.2mm wire |
| 100kHz | 0.21mm | switching-supply windings |
| 1MHz | 66um | 2oz copper (70um) |
| 4MHz | 33um | 1oz copper (35um) |
| 100MHz | 6.6um | about the same as copper surface roughness |
| 1GHz | 2.1um | smaller than surface roughness |
For 1oz copper, 4MHz is the crossover
PCB 1oz copper is 35um thick. δ reaches 35um at (66 / 0.035)² ≈ 3.6MHz, and above that a trace's AC resistance starts to exceed its DC resistance.
About 1.3x DC around 14MHz (δ at half the thickness) and 2.5x at 90MHz (1/5). At 1GHz (δ = 2.1um), with current on both faces, 35 / (2 × 2.1) ≈ 8x; a microstrip skews current toward the plane side, so the real figure is worse.
There is no need to worry about skin effect on a PCB trace below a few tens of MHz. Power traces, motor drive, audio, and a few-MHz SPI or I2C bus can use plain DC resistance. Above 100MHz, resistance rises several times and becomes a transmission-line loss.
Switching-supply windings feel it at 100kHz
Windings feel it before a PCB does. At 100kHz, δ = 0.21mm, so any wire over 0.4mm in diameter stops using its interior. In a φ1.0mm wire only a 0.21mm surface annulus carries current: about 0.52mm² of the 0.785mm² cross-section (Figure 3).
The fixes are litz wire (thin insulated strands bundled together) or flat wire / foil windings.
Proximity effect also occurs: the field of one winding skews current in its neighbor, and loss grows with each layer. Above 100kHz it often dominates over skin effect; the fix is the layer count and interleaving.
In the GHz range, copper roughness doubles the loss
At 1GHz, δ is 2.1um. PCB copper foil is roughened on the back to bond with the resin, typically to Rz 3-8um. The roughness exceeds the depth the current flows in, so current detours along the bumps and its path is longer (Figure 4).
Hammerstad's approximation gives about 1.6x loss when roughness is comparable to δ, saturating near 2x when well above. Foil choice alone can double GHz loss, which is why high-speed boards use low-roughness foils (VLP, HVLP).
In FR-4, conductor and dielectric loss are comparable around 1GHz, and above that dielectric loss (proportional to frequency) overtakes conductor loss (proportional to √f). Designs above 10GHz need a low-loss material too.
What to check with the calculator
Use the skin-effect calculator to get δ, and compare it with the thickness (oz to thickness). If δ ≥ thickness, ignore it. If thickness / δ is 2-5, resistance runs 1.3-2.5x, so put it in the loss budget. Above 10, treat it as transmission-line loss and bring width, material, and roughness into the design.
Frequently asked questions
How much does resistance increase from skin effect?
Does going to 2oz copper reduce high-frequency loss?
Does gold or tin plating on copper make a difference?
At what frequency does skin effect matter for a flat copper power busbar?
Standards and references
- H. W. Johnson, M. Graham, High-Speed Signal Propagation — Skin effect, proximity effect, and the relationship between surface roughness and loss
- E. Hammerstad, O. Jensen (1980) — Approximation for the increase in conductor loss from copper surface roughness
- IPC-4562 — Classification of copper foil types and surface roughness (standard, low-profile, etc.)